PART |
Description |
Maker |
RB160M-30 |
Small power mold type
|
SK Electronics
|
KDZTR24B |
Small power mold type.
|
Rohm
|
MCP3201-CI/SN MCP3201-CI/ST MCP3201-CI/P MCP3201-B |
The MCP3201 12-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ... The MCP3201 12-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making it ideal for embedded control applications. The MCP3201 features a successive approximation register (SAR)
|
Microchip
|
TDZTR15 TDZTR24 TDZTR20 |
Small mold type. (TUMD2), High reliability. Zener diode
|
Rohm
|
UPA833TF UPA833TF-T1 PA833TF |
NPN Silicon Epitaxial Transisitor(NPN外延晶体 NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE
|
NEC Corp. NEC[NEC]
|
MCP3004T-I/SL MCP3004T-I/ST MCP3004-I/P MCP3004-I/ |
The MCP3004 10-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ... The MCP3008 10-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ...
|
Microchip
|
PS21964-ST09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
PS21965-ST09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
PS21963-T09 PS21963-AT PS21963-CT |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
PS21963-ST09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
MCP3202-BI/P MCP3202-BI/SN MCP3202-CI/P MCP3202-CI |
The MCP3202 12-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ...
|
Microchip
|